The new SOP Advance (E) package marks a substantial improvement over Toshiba’s existing SOP Advance (N) package, reducing ...

Infinitesima, a developer of advanced RPM technology for the semiconductor industry, has announced a 3 year project.

With the right architecture, scaling isn’t a risk – it becomes a feature. By investing in modular hardware, robust ...

Siemens Digital Industries Software has collaborated with United Microelectronics (UMC), a semiconductor foundry, to ...

EnSilica has created a combined hardware IP block that supports the full CRYSTALS post-quantum cryptography (PQC) suite.

Lidar-based ADAS systems use invisible laser light to accurately detect objects and determine their distance and velocity. Although lidar systems were previously expensive (over $50,000) and bulky, ...

ALL.SPACE, a provider of multi-orbit, multi-link SATCOM platforms, has been awarded a €3.42 million contract by the ESA.

Goldman Sachs expects HBM prices to decline next year as competition intensifies and pricing power shifts to customers.

In less than three years, Rapidus has achieved its IIM-1 target milestones – from initial groundbreaking in September 2023, ...

Harting’s D‑Sub PushPull connector builds on this legacy by integrating a quick-locking mechanism that speeds up installation ...

Continued innovation is helping to drive the development and growing adoption of wide bandgap materials, such as GaN.

Meech International has announced the introduction of the 906 Hyperion 24V Power Supply Unit (PSU). The unit is a compact, ...