A step-down PCB is simply a multilayer PCB whose board thickness is reduced (stepped down) in a few places. The step-down is ...

SANTA ANA, CA – TTM Technologies has announced the acquisition of a 750,000 sq. ft. facility in Eau Claire, WI, and land rights for a new manufacturing site in Penang, Malaysia.

WASHINGTON – Global semiconductor sales reached $59 billion in May, a 27% year-over-year increase, according to data released today by the Semiconductor Industry Association (SIA). Sales were up 3.5% ...

After a challenging 2023, the IC substrate ecosystem is showing promising signs of recovery. According to Yole Group’s latest projections, the combined market for advanced substrate technologies is ...

Austin, Texas – High Density Packaging User Group (HDP) is pleased to announce that Lincstech Co., Ltd. (Lincstech) has become a member.

Software-defined tools and virtualization are key to scaling networks for 5G, 6G, and future latency-critical applications like AR, autonomous vehicles, and smart factories.

Rebuilding the industrial base will take time and commitment. There has been a lot of talk, chatter, posturing and proclamations by pundits and politicians alike about the soon-to-be American ...

Analog design remains critical in a digital world, demanding precise placement, shielding, and memory tuning for performance in modern RF, IoT, and DDR applications.

Cloud-based collaboration prevents costly errors in PCB design by improving version control, team efficiency, and real-time data access across remote teams.

AI in PCB design faces data-sharing roadblocks and tool limitations. Siemens suggests automation—without AI—still leads, as designers remain skeptical of change.

Progress for glass-core substrates and RDL interposers highlighted ECTC’s 75th anniversary conference. More than 2,500 attendees braved the stormy Texas weather to discuss the latest developments in ...