AI is exceptionally good at spotting anomalies in semiconductor inspection. The challenge is training different models for ...
Companies need engineers across all disciplines and universities are stepping up to deliver them; schools reap benefits, too.
Chuck was also the moderator for the opening plenary session Chiplets: Where We Are Today. The speakers were Jim Handy of ...
Keysight’s Richard Duvall highlights the need for rigorous simulation and validation to overcome challenges such as signal ...
A new technical paper titled “Thermally Dependent Metastability of Indium-Tungsten-Oxide Thin-Film Transistors” was published by researchers at Rochester Institute of Technology and Corning Research ...
Optimization of the Inter-Chiplet Interconnect And The Chiplet Placement (ETH Zurich, U. of Bologna)
Placement-based Inter-Chiplet Interconnect Topologies” was published by researchers at ETH Zurich and University of Bologna.
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