Proven AI and HPC ASIC Design Flow Production-ready. Taipei, Taiwan -- Jan 17, 2025-- Alchip Technologies, Limited, the high-performance ASIC leader, has formally opened its three-dimensional integrated circuit (3DIC) design services for the latest high-performance ASICs targeting AI and high-performance computing (HPC) applications.. 3DIC design refers to a cutting-edge semiconductor ...

This white paper explores the integration of advanced PVT sensors into DVFS frameworks to overcome these limitations. Building on research innovations in energy-efficient computing, the paper demonstrates how Innosilicon’s PVT sensor provides a reliable and scalable solution to address process variability, voltage scaling, and thermal management.

Design And Reuse, The Web's System On Chip Design Resource : catalogs of IPs, Virtual Components, Cores for designing System-on-Chip (SOC)

Feb 4, 2025 · Ceva today announced that WUQI Microelectronics, a leading semiconductor fabless company focus on connectivity and edge AI chips, has licensed and deployed the Ceva-Waves Wi-Fi 6 High-Performance STA IP platform in its WQ9201 Wi-Fi/Bluetooth combo chip. CoMira Solutions today announced its new 1.6T ...

The objective of this paper is to illustrate congestion, shorts, and practical approaches to fix both issues at lower/higher technology nodes. This paper also includes PnR tool (ICC2) related commands and their uses to overcome the mentioned issues.

Since its inception, BCD technology has leveraged the integration of two primary technologies—polysilicon gate CMOS and DMOS power architecture—on the same chip. Its compatibility with bipolar components has enabled the creation of SoCs (System-on-Chip) that combine digital and analog control with efficient power management sections.

D&R provides the world's largest directory of Silicon IP (Intellectual Property), SoC Configurable Design Platforms and SOPC Products from 400 vendors

By Abhishek BV, eInfochips. Abstract: In analog layout design, precise layout matching techniques are crucial to ensure the accuracy and performance of the circuit so that transistors exhibit similar electrical properties (i.e. transconductance, current gain, and drain capacitance).

Dec 11, 2024 · Hyderabad, India -- December 11, 2024 — MosChip® Technologies selects Cadence 5nm EDA tools for the design of the High-Performance Computing (HPC) Processor “AUM” for C-DAC.. MosChip® Technologies is the first fabless semiconductor company publicly traded in India. It has over twenty-five years of experience designing products and SoCs with a vision to be a preferred partner for ...

Vipul Patel, einfochips ltd. Abstract. The main objective of this paper is to explain the various types of design rule checks (DRC) violation, their causes and how to fix the various design rule checks (DRC) at lower technology node on block level as well as full chip level implementation while meeting the design rule with respect to latest technology standards.